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While gas filters differ in materials of construction, from one supplier to the next, the mechanisms for capturing particles are the same. The particle removal efficiency of a membrane filter used in gas service is substantially different from one used in liquid service. Particles are captured on the membrane by mechanisms such as interception, diffusion, impaction, and electrostatic deposition for gas service. Each of these particle capture mechanisms is strongly influenced by particle size and flow rate.
As the demand for dry processing steps has increased, so has the importance of contamination control for CVD, Etch, Epitaxial, Ion Implant, and PVD gases used during the manufacture of semiconductor devices. While material suppliers provide ultra high purity gases, the end user must be able to maintain that purity level while eliminating any contamination from the gas delivery system. Proper filtration for bulk, point-at-distribution, and point-of-use applications is absolutely critical in maintaining an ultra high purity gas system.
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